8200901JX
vs
8200901LA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP,
CERAMIC, DIP-24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
45 ns
100 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Screening Level
MIL-STD-883
MIL-STD-883
Supply Current-Max
0.19 mA
0.19 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
24
JESD-609 Code
e0
Package Equivalence Code
DIP24,.3
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
Terminal Pitch
2.54 mm
Compare 8200901JX with alternatives
Compare 8200901LA with alternatives