8103607SA vs PAL16L8BMW/883B feature comparison

8103607SA Rochester Electronics LLC

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PAL16L8BMW/883B AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC ADVANCED MICRO DEVICES INC
Part Package Code DFP DFP
Package Description DFP, DFP, FL20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
Additional Feature REGISTER PRELOAD; POWER-UP RESET PAL
JESD-30 Code R-GDFP-F20 R-CDFP-F20
Length 13.0175 mm 12.954 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Programmable Logic Type OT PLD OT PLD
Propagation Delay 30 ns 25 ns
Qualification Status MILITARY Not Qualified
Seated Height-Max 2.286 mm 2.286 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6.731 mm 9.779 mm
Base Number Matches 3 2
Rohs Code No
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Architecture PAL-TYPE
JESD-609 Code e0
Number of Inputs 16
Number of Outputs 8
Number of Product Terms 64
Package Equivalence Code FL20,.3
Screening Level 38535Q/M;38534H;883B
Terminal Finish TIN LEAD

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