8103607RX vs PAL16L8AMJ feature comparison

8103607RX Texas Instruments

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PAL16L8AMJ Monolithic Memories Inc (MMI)

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MONOLITHIC MEMORIES
Part Package Code DIP
Package Description DIP, DIP-20
Pin Count 20
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
JESD-30 Code R-GDIP-T20 R-XDIP-T20
Number of Dedicated Inputs 10
Number of I/O Lines 6
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 30 ns 30 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Base Number Matches 2 2
Rohs Code No
Architecture PAL-TYPE
JESD-609 Code e0
Number of Inputs 16
Number of Outputs 8
Number of Product Terms 64
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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