8101
vs
8104
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LSI CORP
|
LSI CORP
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
PLASTIC, QFP-208
|
17 X 17 MM, 1 MM PITCH, MO-151, MBGA-208
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| Data Transfer Rate-Max |
125 MBps
|
125 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B208
|
| JESD-609 Code |
e0
|
e0
|
| Length |
28 mm
|
17 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Serial I/Os |
10
|
10
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
1.76 mm
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
28 mm
|
17 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
3
|
1
|
| Communication Protocol |
|
ASYNC, BIT
|
|
|
|