8100613EA
vs
HI1-5042-2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
HARRIS SEMICONDUCTOR
Package Description
CERAMIC, DIP-16
DIP-16
Reach Compliance Code
unknown
unknown
Analog IC - Other Type
DPST
SPDT
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
16
16
Off-state Isolation-Nom
60 dB
80 dB
On-state Resistance-Max (Ron)
75 Ω
75 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
350 ns
500 ns
Switch-on Time-Max
500 ns
500 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Rohs Code
HTS Code
8542.39.00.01
JESD-609 Code
e0
On-state Resistance Match-Nom
2 Ω
Package Equivalence Code
DIP16,.3
Switching
BREAK-BEFORE-MAKE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
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