80HCPS1848CHMI
vs
80HCPS1848CRM
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
FCBGA
|
FCBGA
|
| Package Description |
FCBGA-784
|
FCBGA-784
|
| Pin Count |
784
|
784
|
| Manufacturer Package Code |
HM784
|
RM784
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B784
|
S-PBGA-B784
|
| JESD-609 Code |
e0
|
e1
|
| Length |
29 mm
|
29 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
784
|
784
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA784,28X28,40
|
BGA784,28X28,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
250
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.83 mm
|
2.83 mm
|
| Supply Current-Max |
7940 mA
|
7940 mA
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| Base Number Matches |
1
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|