80HCPS1616CHLG
vs
80HCPS1616RMI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
FCBGA
FCBGA
Package Description
FCBGA-400
BGA, BGA400,20X20,40
Pin Count
400
400
Manufacturer Package Code
HLG400
RM400
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2016-04-04
JESD-30 Code
S-PBGA-B400
S-PBGA-B400
JESD-609 Code
e1
Length
21 mm
21 mm
Moisture Sensitivity Level
4
4
Number of Terminals
400
400
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Seated Height-Max
3.34 mm
2.83 mm
Supply Voltage-Max
1.05 V
Supply Voltage-Min
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Base Number Matches
2
2
Number of Functions
1
Package Equivalence Code
BGA400,20X20,40
Qualification Status
Not Qualified
Supply Current-Max
4730 mA
Telecom IC Type
TELECOM CIRCUIT