80C31BH/BQA
vs
D80C31BH
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
|
| Package Description |
CERAMIC, DIP-40
|
DIP-40
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| CPU Family |
8051
|
8051
|
| Clock Frequency-Max |
12 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
8
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-GDIP-T40
|
R-XDIP-T40
|
| Length |
52.3875 mm
|
|
| Low Power Mode |
YES
|
|
| Number of I/O Lines |
32
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
128
|
128
|
| ROM (words) |
0
|
|
| ROM Programmability |
ROM LESS
|
|
| Seated Height-Max |
5.588 mm
|
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage-Max |
6 V
|
|
| Supply Voltage-Min |
4 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
5
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 80C31BH/BQA with alternatives
Compare D80C31BH with alternatives