80C31BH/BMA
vs
TSC80C31-44LB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ATMEL CORP
|
Part Package Code |
QFP
|
LCC
|
Package Description |
QCCJ,
|
QCCJ,
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
8051
|
|
Clock Frequency-Max |
12 MHz
|
44.05 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-CQCC-J44
|
S-PQCC-J44
|
Length |
16.4465 mm
|
16.5862 mm
|
Low Power Mode |
YES
|
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
PWM Channels |
NO
|
NO
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
128
|
|
ROM (words) |
0
|
0
|
ROM Programmability |
ROM LESS
|
ROM LESS
|
Seated Height-Max |
4.83 mm
|
4.57 mm
|
Speed |
12 MHz
|
44 MHz
|
Supply Current-Max |
20 mA
|
|
Supply Voltage-Max |
6 V
|
5.5 V
|
Supply Voltage-Min |
4 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.4465 mm
|
16.5862 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
4
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
2
|
Peak Reflow Temperature (Cel) |
|
245
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare 80C31BH/BMA with alternatives
Compare TSC80C31-44LB with alternatives