80387DXRPQB
vs
MC68881RC16
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
DATA DEVICE CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
,
|
PGA, PGA68,10X10
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| JESD-30 Code |
|
S-XPGA-P68
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
68
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
PGA
|
| Package Equivalence Code |
|
PGA68,10X10
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Power Supplies |
|
5 V
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
150 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
NO
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
PIN/PEG
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
PERPENDICULAR
|
|
|
|
Compare 80387DXRPQB with alternatives