80186/BZC
vs
MC68000CRC12
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
PGA
Package Description
PGA, PGA68,11X11
PGA, PGA68,10X10
Pin Count
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
20
Bit Size
16
32
Boundary Scan
NO
Clock Frequency-Max
16 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-CPGA-P68
S-XPGA-P68
JESD-609 Code
e0
e0
Length
29.464 mm
Low Power Mode
NO
Number of DMA Channels
2
Number of External Interrupts
5
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
PGA
PGA
Package Equivalence Code
PGA68,11X11
PGA68,10X10
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
4.953 mm
Speed
8 MHz
12.5 MHz
Supply Current-Max
600 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
MOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
29.464 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
3
Power Supplies
5 V
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