8001901DA vs M38510/30005B2X feature comparison

8001901DA QP Semiconductor

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M38510/30005B2X QP Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC QP SEMICONDUCTOR INC
Part Package Code DFP QLCC
Package Description DFP, QCCN,
Pin Count 14 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F14 S-CQCC-N20
Length 9.21 mm
Logic IC Type AND GATE NAND GATE
Number of Functions 4 3
Number of Inputs 2 3
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP QCCN
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK CHIP CARRIER
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 53 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.03 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 6.29 mm
Base Number Matches 1 1
Package Equivalence Code LCC20,.35SQ

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