8001901DA
vs
M38510/30005B2X
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
QP SEMICONDUCTOR INC
|
Part Package Code |
DFP
|
QLCC
|
Package Description |
DFP,
|
QCCN,
|
Pin Count |
14
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LS
|
LS
|
JESD-30 Code |
R-GDFP-F14
|
S-CQCC-N20
|
Length |
9.21 mm
|
|
Logic IC Type |
AND GATE
|
NAND GATE
|
Number of Functions |
4
|
3
|
Number of Inputs |
2
|
3
|
Number of Terminals |
14
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
QCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
|
Propagation Delay (tpd) |
53 ns
|
24 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.03 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
|
Width |
6.29 mm
|
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
LCC20,.35SQ
|
|
|
|
Compare 8001901DA with alternatives
Compare M38510/30005B2X with alternatives