7P032FLA591C15
vs
EDI7P032FLD2300C15
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
CARD
|
|
| Package Description |
,
|
CARD-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
150 ns
|
150 ns
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
X-XXMA-X68
|
X-XXMA-X68
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
FLASH CARD
|
FLASH CARD
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16MX16
|
16MX16
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.035 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
| Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
2
|
2
|
|
|
|
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