7MP4145S25M
vs
EDI8F32259V12MMC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
ELECTRONIC DESIGNS INC
|
Package Description |
SIMM, SSIM72
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
25 ns
|
12 ns
|
Additional Feature |
WD-MAX
|
CONFIGURABLE AS 256K X 32
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-XSMA-N72
|
R-XSMA-N72
|
JESD-609 Code |
e0
|
|
Length |
107.95 mm
|
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
72
|
72
|
Number of Words |
262144 words
|
1048576 words
|
Number of Words Code |
256000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX32
|
1MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
SIMM
|
SIMM
|
Package Equivalence Code |
SSIM72
|
SSIM72
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
16.256 mm
|
15.24 mm
|
Standby Current-Max |
0.12 A
|
0.04 A
|
Standby Voltage-Min |
4.5 V
|
3 V
|
Supply Current-Max |
1.36 mA
|
1.44 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
SINGLE
|
SINGLE
|
Width |
8.89 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare 7MP4145S25M with alternatives
Compare EDI8F32259V12MMC with alternatives