79RV5000250BS272
vs
SPC5200CVR466BR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA272,20X20,50
Pin Count
272
272
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
32
Bit Size
64
32
Boundary Scan
YES
YES
Clock Frequency-Max
125 MHz
35 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e1
Low Power Mode
YES
YES
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
250 MHz
466 MHz
Supply Voltage-Max
3.465 V
1.58 V
Supply Voltage-Min
3.135 V
1.42 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Length
27 mm
Moisture Sensitivity Level
3
Package Equivalence Code
BGA272,20X20,50
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Seated Height-Max
2.65 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
Compare 79RV5000250BS272 with alternatives
Compare SPC5200CVR466BR2 with alternatives