79RV4650-180DP9
vs
MIP7965-668F24M
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
FQFP,
|
FQFP,
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
64
|
| Bit Size |
64
|
64
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
180 MHz
|
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G208
|
S-CQFP-G208
|
| JESD-609 Code |
e0
|
|
| Length |
28 mm
|
28.448 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
115 °C
|
| Operating Temperature-Min |
|
-45 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.1 mm
|
3.531 mm
|
| Speed |
180 MHz
|
668 MHz
|
| Supply Voltage-Max |
3.465 V
|
|
| Supply Voltage-Min |
3.135 V
|
|
| Supply Voltage-Nom |
3.3 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28.448 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 79RV4650-180DP9 with alternatives
Compare MIP7965-668F24M with alternatives