79RC32V334-133BB
vs
MC9328MX1VM20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
27 X 27 MM, PLASTIC, BGA-256
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
Pin Count
256
Reach Compliance Code
not_compliant
compliant
Address Bus Width
32
25
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
16 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
14 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
225
260
Power Supplies
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
1.6 mm
Speed
133 MHz
200 MHz
Supply Current-Max
630 mA
Supply Voltage-Max
3.465 V
2 V
Supply Voltage-Min
3.135 V
1.8 V
Supply Voltage-Nom
3.3 V
1.9 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
40
Width
17 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
4
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Technology
CMOS
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