79RC32V333100DHI
vs
ACT-7000ASC-350F24T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
QFP
|
|
| Package Description |
FQFP, QFP208,1.2SQ,20
|
QFP, QFP208,1.2SQ,20
|
| Pin Count |
208
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
64
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
50 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PQFP-G208
|
S-XQFP-G208
|
| JESD-609 Code |
e0
|
|
| Length |
28 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
FQFP
|
QFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
|
| Speed |
100 MHz
|
350 MHz
|
| Supply Current-Max |
480 mA
|
|
| Supply Voltage-Max |
3.465 V
|
|
| Supply Voltage-Min |
3.135 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
28 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
3
|
|
|
|
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