79RC32V333100DH
vs
ACT-5261PC-250F24C
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
QFP
Package Description
FQFP, QFP208,1.2SQ,20
,
Pin Count
208
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PQFP-G208
JESD-609 Code
e0
Length
28 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
208
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
FQFP
Package Equivalence Code
QFP208,1.2SQ,20
Package Shape
SQUARE
Package Style
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
4.1 mm
Speed
100 MHz
Supply Current-Max
480 mA
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
28 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
3
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