79RC32V333100DH vs ACT-5261PC-250F24C feature comparison

79RC32V333100DH Integrated Device Technology Inc

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ACT-5261PC-250F24C Cobham Advanced Electronic Solutions

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code QFP
Package Description FQFP, QFP208,1.2SQ,20 ,
Pin Count 208
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 50 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PQFP-G208
JESD-609 Code e0
Length 28 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 208
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 4.1 mm
Speed 100 MHz
Supply Current-Max 480 mA
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 3

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