79RC32T355133DHI
vs
79RV4650-200DP9
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
28 X 28 MM, 3.40 MM HEIGHT, MO-143FA1, PLASTIC, QFP-208
FQFP,
Pin Count
208
208
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
26
64
Bit Size
32
64
Boundary Scan
YES
NO
Clock Frequency-Max
67 MHz
200 MHz
External Data Bus Width
32
64
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
JESD-609 Code
e0
e0
Length
28 mm
28 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Equivalence Code
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Speed
133 MHz
200 MHz
Supply Voltage-Max
2.625 V
3.465 V
Supply Voltage-Min
2.375 V
3.135 V
Supply Voltage-Nom
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
28 mm
28 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare 79RC32T355133DHI with alternatives
Compare 79RV4650-200DP9 with alternatives