79RC32H434266BCI
vs
XPC823ZT25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MOTOROLA INC
Part Package Code
BGA
Package Description
LBGA, BGA256,16X16,40
BGA,
Pin Count
256
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
125 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
23 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
3
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.35 mm
Speed
266 MHz
Supply Voltage-Max
1.3 V
3.6 V
Supply Voltage-Min
1.1 V
3 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
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