79R3081E33MJ vs N80C186EB-8 feature comparison

79R3081E33MJ Integrated Device Technology Inc

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N80C186EB-8 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEL CORP
Part Package Code QFN LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 16 MHz
External Data Bus Width 32 16
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.083 mm 29.3 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 84 84
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.83 mm
Speed 33 MHz 8 MHz
Supply Current-Max 1050 mA 50 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.083 mm 29.3 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1

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Compare N80C186EB-8 with alternatives