79R308150MJ vs 79R308150MJM feature comparison

79R308150MJ Integrated Device Technology Inc

Buy Now Datasheet

79R308150MJM Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN QFN
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.083 mm 29.083 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Terminals 84 84
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Speed 50 MHz 50 MHz
Supply Current-Max 825 mA 825 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.083 mm 29.083 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare 79R308150MJ with alternatives

Compare 79R308150MJM with alternatives