79R3041-33J8 vs IDT79R3051-25J8 feature comparison

79R3041-33J8 Integrated Device Technology Inc

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IDT79R3051-25J8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ,
Pin Count 84 84
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature BURST BUS; 5 PIPELINE STAGES BURST BUS; 5 PIPELINE STAGES
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 66.66 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.286 mm 29.3116 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1
Number of Terminals 84 84
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Speed 33 MHz 25 MHz
Supply Current-Max 370 mA 400 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.286 mm 29.3116 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0

Compare 79R3041-33J8 with alternatives

Compare IDT79R3051-25J8 with alternatives