7704701EA vs HEF4555BPN feature comparison

7704701EA Defense Logistics Agency

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HEF4555BPN NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer DEFENSE LOGISTICS AGENCY NXP SEMICONDUCTORS
Package Description DIP-16 DIP, DIP16,.3
Reach Compliance Code unknown unknown
Additional Feature 2 ENABLE INPUTS
Family 4000/14000/40000 4000/14000/40000
Input Conditioning STANDARD STANDARD
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 245
Propagation Delay (tpd) 660 ns 230 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38535
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
HTS Code 8542.39.00.01
Length 21.6 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 295 ns
Seated Height-Max 4.7 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 7704701EA with alternatives

Compare HEF4555BPN with alternatives