74VHC157SJX
vs
MC74AC157M
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
Package Description |
SOP, SOP16,.3
|
EIAJ-16
|
Manufacturer Package Code |
565BF
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Family |
AHC/VHC
|
AC
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e4
|
Length |
10.1 mm
|
10.2 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.004 A
|
0.012 A
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.3
|
SOP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
RAIL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Supply Current-Max (ICC) |
0.04 mA
|
|
Prop. Delay@Nom-Sup |
9.5 ns
|
13 ns
|
Propagation Delay (tpd) |
15 ns
|
9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.1 mm
|
2.05 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5.3 mm
|
5.275 mm
|
Base Number Matches |
1
|
7
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
|
|
|
Compare 74VHC157SJX with alternatives
Compare MC74AC157M with alternatives