74VHC14CW
vs
74LVC06ABQ,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
CUSTOM
QFN
Package Description
DIE,
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Pin Count
0
14
Manufacturer Package Code
Unsawn Tested Wafer
SOT762-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AHC/VHC
LVC/LCX/Z
JESD-30 Code
R-XUUC-N14
R-PQCC-N14
Logic IC Type
INVERTER
INVERTER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
14
14
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
HVQCCN
Package Equivalence Code
DIE OR CHIP
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)
16.3 ns
5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
QUAD
Base Number Matches
2
2
Rohs Code
Yes
JESD-609 Code
e4
Length
3 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Output Characteristics
OPEN-DRAIN
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
5 ns
Schmitt Trigger
NO
Seated Height-Max
1 mm
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
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