74VHC123AM
vs
HD74HC423AP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
HITACHI LTD
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
0.150 INCH, MS-012, SOIC-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
RETRIGGERABLE
|
|
Family |
AHC/VHC
|
HC/UH
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e3
|
|
Length |
10.3 mm
|
19.2 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MONOSTABLE MULTIVIBRATOR
|
MONOSTABLE MULTIVIBRATOR
|
Moisture Sensitivity Level |
1
|
|
Number of Data/Clock Inputs |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
27.5 ns
|
300 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
5.06 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
4.5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
7.62 mm
|
Base Number Matches |
10
|
1
|
|
|
|
Compare 74VHC123AM with alternatives
Compare HD74HC423AP with alternatives