74VCX38BQX
vs
HCS10HMSR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
INTERSIL CORP
|
| Part Package Code |
QFN
|
DIE
|
| Package Description |
HVQCCN,
|
DIE,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
ALVC/VCX/A
|
HC/UH
|
| JESD-30 Code |
R-XQCC-N14
|
R-XUUC-N14
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
3
|
| Number of Inputs |
2
|
3
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
33.5 ns
|
22 ns
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Qualification Status |
|
Not Qualified
|
| Total Dose |
|
200k Rad(Si) V
|
|
|
|
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