74VCX132BQX
vs
5962R9665001V9A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
INTERSIL CORP
|
| Part Package Code |
QFN
|
DIE
|
| Package Description |
2.50 X 3 MM, MO-241AA, DQFN-14
|
DIE,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALVC/VCX/A
|
4000/14000/40000
|
| JESD-30 Code |
R-XQCC-N14
|
X-XUUC-N14
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
NAND GATE
|
AND-OR GATE
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DIE
|
| Package Equivalence Code |
LCC14,.1X.12,20
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
3.3 ns
|
|
| Propagation Delay (tpd) |
16.4 ns
|
810 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
1.4 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Width |
2.5 mm
|
|
| Base Number Matches |
1
|
1
|
| Output Characteristics |
|
3-STATE
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare 74VCX132BQX with alternatives
Compare 5962R9665001V9A with alternatives