Findchips: Compare 74V1G70STR vs 74LVC1G07GW,118

74V1G70STR vs 74LVC1G07GW,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	STMICROELECTRONICS	NXP SEMICONDUCTORS
Part Package Code	SOT-23	TSSOP
Package Description	SOT-23, 5 PIN	TSSOP,
Pin Count	5	5
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01
Family	74V	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.9 mm	2.05 mm
Load Capacitance (CL)	50 pF
Logic IC Type	BUFFER	BUFFER
Max I(ol)	0.004 A
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LSSOP	TSSOP
Package Equivalence Code	TSOP5/6,.11,37
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	10 ns
Propagation Delay (tpd)	10 ns	8.4 ns
Qualification Status	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.45 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	Matte Tin (Sn) - annealed	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.95 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.625 mm	1.25 mm
Base Number Matches	1	2
Manufacturer Package Code		SOT353-1
Output Characteristics		OPEN-COLLECTOR
	Logic » Gates	Logic » Gates