74V1G00C
vs
74HC1G02GW-Q100,12
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STMICROELECTRONICS
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
TSSOP, TSSOP6,.08
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1,TSSOP-5
Pin Count
5
5
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
Family
74V
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e0
e3
Length
2 mm
2.05 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NOR GATE
Max I(ol)
0.004 A
0.002 A
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP6,.08
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
13 ns
27 ns
Propagation Delay (tpd)
11.5 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
TIN LEAD
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT353-1
Packing Method
TR
Screening Level
AEC-Q100
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