74SSTUB32865AZJBR
vs
SSTUA32864BHLFT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
PLASTIC, TFBGA-160
LFBGA,
Pin Count
160
96
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B160
R-PBGA-B96
JESD-609 Code
e1
e1
Length
13 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
410000000 Hz
Max I(ol)
0.012 A
Moisture Sensitivity Level
3
3
Number of Bits
28
25
Number of Functions
1
1
Number of Terminals
160
96
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
OPEN-DRAIN
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA160,12X18,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
1.1 ns
Propagation Delay (tpd)
3 ns
1.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
9 mm
5.5 mm
fmax-Min
410 MHz
410 MHz
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
BFG96
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