74SSTU32865BKG
vs
SSTUA32864EC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
CABGA
BGA
Package Description
BGA, BGA160,12X18,25
LFBGA, BGA96,6X16,32
Pin Count
160
96
Manufacturer Package Code
BKG160
SOT-536-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B160
R-PBGA-B96
JESD-609 Code
e1
e0
Length
13 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
3
Number of Bits
28
25
Number of Functions
1
1
Number of Terminals
160
96
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Equivalence Code
BGA160,12X18,25
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
2.15 ns
1.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.3 mm
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
9 mm
5.5 mm
fmax-Min
270 MHz
450 MHz
Base Number Matches
2
2
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Compare SSTUA32864EC with alternatives