74S08F
vs
S54S08F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
NXP SEMICONDUCTORS
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
S
S
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Load Capacitance (CL)
15 pF
15 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
14.25 mA
14.25 mA
Propagation Delay (tpd)
7.5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
JESD-609 Code
e0
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
7.5 ns
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare 74S08F with alternatives
Compare S54S08F with alternatives