74LVX374SJX
vs
5962H9659201QXC
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP,
|
DFP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAX OUTPUT SKEW = 1.5NS; INPUTS CAN BE DRIVEN BY 3V OR 5V COMPONENTS
|
WITH DUAL OUTPUT ENABLE
|
| Family |
LV/LV-A/LVX/H
|
AC
|
| JESD-30 Code |
R-PDSO-G20
|
R-CDFP-F20
|
| Length |
12.6 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Propagation Delay (tpd) |
16 ns
|
13 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.108 mm
|
2.921 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
6.9215 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| Package Equivalence Code |
|
FL20,.3
|
| Terminal Finish |
|
GOLD
|
| Total Dose |
|
1M Rad(Si) V
|
|
|
|
Compare 74LVX374SJX with alternatives
Compare 5962H9659201QXC with alternatives