74LVX163MTC
vs
74LV163PW
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP16,.25
|
TSSOP,
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
TCO OUTPUT
|
TCO OUTPUT
|
Count Direction |
UP
|
UP
|
Family |
LV/LV-A/LVX/H
|
LV/LV-A/LVX/H
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
|
Length |
5 mm
|
5 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Load/Preset Input |
YES
|
YES
|
Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
Max Frequency@Nom-Sup |
50000000 Hz
|
|
Max I(ol) |
0.004 A
|
|
Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
18.5 ns
|
44 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
4.4 mm
|
4.4 mm
|
fmax-Min |
50 MHz
|
20 MHz
|
Base Number Matches |
3
|
2
|
|
|
|
Compare 74LVX163MTC with alternatives
Compare 74LV163PW with alternatives