74LVX132MTCX
vs
74LV132PW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NEXPERIA
Package Description
4.40 MM, PLASTIC, TSSOP-14
Reach Compliance Code
unknown
compliant
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
17.5 ns
43 ns
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
5
3
Rohs Code
HTS Code
8542.39.00.01
Date Of Intro
1994-07-01
JESD-609 Code
e4
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP14,.25
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
25 ns
Schmitt Trigger
YES
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
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