74LVX125MSCX
vs
74LVCH125ADB
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
SSOP
|
|
Package Description |
LSSOP, SSOP14,.25
|
SSOP,
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MAX OUTPUT SKEW = 1.5NS; INPUTS CAN BE DRIVEN BY 3V OR 5V COMPONENTS
|
|
Control Type |
ENABLE LOW
|
|
Family |
LV/LV-A/LVX/H
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
|
Length |
5 mm
|
6.2 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.004 A
|
|
Number of Bits |
1
|
1
|
Number of Functions |
4
|
4
|
Number of Ports |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
SSOP
|
Package Equivalence Code |
SSOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Packing Method |
TR
|
|
Prop. Delay@Nom-Sup |
12 ns
|
|
Propagation Delay (tpd) |
12 ns
|
5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
5.3 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare 74LVX125MSCX with alternatives
Compare 74LVCH125ADB with alternatives