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74LVTH16245BDL,112 vs 74LVC16245AEV feature comparison

74LVTH16245BDL,112 NXP Semiconductors

Buy Now Datasheet

74LVC16245AEV Philips Semiconductors

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SSOP
Package Description 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48 FBGA, BGA56,6X10,25
Pin Count 48
Manufacturer Package Code SOT370-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVT
JESD-30 Code R-PDSO-G48 R-PBGA-B56
JESD-609 Code e4 e0
Length 15.875 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER
Max I(ol) 0.064 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2
Number of Terminals 48 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP FBGA
Package Equivalence Code SSOP48,.4 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH GRID ARRAY, FINE PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 3.3 ns 4.5 ns
Propagation Delay (tpd) 3.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn63Pb37)
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm
Base Number Matches 2 3
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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