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74LVT32374EC,557 vs 74LVT32374EC-T feature comparison

74LVT32374EC,557 NXP Semiconductors

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74LVT32374EC-T NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 LFBGA,
Pin Count 96 96
Manufacturer Package Code SOT536-1 SOT-536-1
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVT LVT
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 13.5 mm 13.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.064 A
Moisture Sensitivity Level 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 5.3 ns
Propagation Delay (tpd) 6.2 ns 6.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE
Width 5.5 mm 5.5 mm
Base Number Matches 1 1
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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