74LVT245BQ,115
vs
74ALVCH32245BFG8
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFN
|
CABGA
|
| Package Description |
2.50 X 4.50 MM, 0.85 MM HEIGHT, MO-241, SOT764-1, PLASTIC, DHVQFN-20
|
LFBGA-96
|
| Pin Count |
20
|
96
|
| Manufacturer Package Code |
SOT764-1
|
BFG96
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
WITH DIRECTION CONTROL
|
WITH DIRECTION CONTROL
|
| Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LVT
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PQCC-N20
|
R-PBGA-B96
|
| JESD-609 Code |
e4
|
e1
|
| Length |
4.5 mm
|
13.5 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.064 A
|
0.024 A
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
96
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFBGA
|
| Package Equivalence Code |
LCC20,.1X.18,20
|
BGA96,6X16,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
4 ns
|
3 ns
|
| Propagation Delay (tpd) |
4.7 ns
|
3.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.5 mm
|
5.5 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Date Of Intro |
|
1998-12-01
|
| Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare 74LVT245BQ,115 with alternatives
Compare 74ALVCH32245BFG8 with alternatives