74LVT244BDB,118 vs 74LVT244DB-T feature comparison

74LVT244BDB,118 NXP Semiconductors

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74LVT244DB-T NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP2
Package Description 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20 SSOP,
Pin Count 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Family LVT LVT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 7.2 mm 7.2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 3.5 ns
Propagation Delay (tpd) 3.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 1
Additional Feature INPUTS CAN BE DRIVEN BY 3.3V OR 5V COMPONENTS
Power Supply Current-Max (ICC) 12 mA

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