74LVT16374AEV vs 74LVT16374AEV,157 feature comparison

74LVT16374AEV NXP Semiconductors

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74LVT16374AEV,157 Nexperia

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description VFBGA, VFBGA, BGA56,6X10,25
Pin Count 56 56
Manufacturer Package Code SOT702-1 SOT702-1
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVT LVT
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 5.6 ns 5.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 4.5 mm 4.5 mm
Base Number Matches 10 1
Samacsys Manufacturer Nexperia
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.064 A
Prop. Delay@Nom-Sup 5 ns
Trigger Type POSITIVE EDGE

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