74LVT16245GX
vs
935288811515
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
LFBGA, BGA54,6X9,32
|
HVBCC,
|
| Pin Count |
54
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Control Type |
COMMON CONTROL
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| Family |
LVT
|
LVT
|
| JESD-30 Code |
R-PBGA-B54
|
R-PBCC-B60
|
| JESD-609 Code |
e0
|
|
| Length |
8 mm
|
6 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.064 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
54
|
60
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
HVBCC
|
| Package Equivalence Code |
BGA54,6X9,32
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
3.5 ns
|
|
| Propagation Delay (tpd) |
3.9 ns
|
3.5 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BUTT
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
5.5 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
WITH DIRECTION CONTROL
|
|
|
|
Compare 74LVT16245GX with alternatives
Compare 935288811515 with alternatives