We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

74LVT16245BDL,118 vs 74LVC16245AEV/G,51 feature comparison

74LVT16245BDL,118 NXP Semiconductors

Buy Now Datasheet

74LVC16245AEV/G,51 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP BGA
Package Description 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48 VFBGA, BGA56,6X10,25
Pin Count 48 56
Manufacturer Package Code SOT370-1 SOT702-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LVT LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PBGA-B56
JESD-609 Code e4
Length 15.875 mm 7 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Number of Bits 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 56
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP VFBGA
Package Equivalence Code SSOP48,.4 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supply Current-Max (ICC) 6 mA
Prop. Delay@Nom-Sup 3.3 ns
Propagation Delay (tpd) 3.5 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 0.97 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.5 mm 4.5 mm
Base Number Matches 1 1
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

Compare 74LVT16245BDL,118 with alternatives

Compare 74LVC16245AEV/G,51 with alternatives