74LVT16245BBX vs 74LVTH16245BBQ,518 feature comparison

74LVT16245BBX NXP Semiconductors

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74LVTH16245BBQ,518 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description HVBCC, VBCC, SLGA60,8X12,20
Pin Count 60 60
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Family LVT LVT
JESD-30 Code R-PBCC-B60 R-PBCC-B60
Length 6 mm 6 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Moisture Sensitivity Level 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 60 60
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVBCC VBCC
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 3.5 ns 3.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BUTT BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm 4 mm
Base Number Matches 2 1
Manufacturer Package Code SOT1134-1
Additional Feature WITH DIRECTION CONTROL
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Load Capacitance (CL) 50 pF
Max I(ol) 0.064 A
Package Equivalence Code SLGA60,8X12,20
Packing Method TR
Prop. Delay@Nom-Sup 3.3 ns

Compare 74LVT16245BBX with alternatives

Compare 74LVTH16245BBQ,518 with alternatives