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74LVT16244BEV,157 vs 74LVT16244BEV feature comparison

74LVT16244BEV,157 NXP Semiconductors

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74LVT16244BEV Nexperia

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code BGA
Package Description VFBGA, BGA56,6X10,25 VFBGA,
Pin Count 56
Manufacturer Package Code SOT702-1
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family LVT LVT
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7 mm 7 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Prop. Delay@Nom-Sup 3.2 ns
Propagation Delay (tpd) 4 ns 4 ns
Qualification Status Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 4.5 mm 4.5 mm
Base Number Matches 2 3
Date Of Intro 2017-02-01
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 20
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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