74LVQ273SCX
vs
74LVQ273T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
0.300 INCH, MS-013, SOIC-20
|
TSSOP, TSSOP20,.25
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVQ
|
LVQ
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e3
|
e0
|
Length |
12.8 mm
|
6.5 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
75000000 Hz
|
70000000 Hz
|
Max I(ol) |
0.012 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP20,.4
|
TSSOP20,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Prop. Delay@Nom-Sup |
14.5 ns
|
14 ns
|
Propagation Delay (tpd) |
20.5 ns
|
16 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
7.5 mm
|
4.4 mm
|
fmax-Min |
75 MHz
|
70 MHz
|
Base Number Matches |
4
|
1
|
|
|
|
Compare 74LVQ273SCX with alternatives
Compare 74LVQ273T with alternatives