74LVCZ16244ADGVRG4
vs
935277682551
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
TSSOP, TSSOP48,.25,16
LFBGA,
Pin Count
48
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G48
R-PBGA-B96
JESD-609 Code
e4
e0
Length
9.7 mm
13.5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
4
8
Number of Ports
2
2
Number of Terminals
48
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFBGA
Package Equivalence Code
TSSOP48,.25,16
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
4.1 ns
Propagation Delay (tpd)
4.4 ns
4.7 ns
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.4 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
5.5 mm
Base Number Matches
1
1
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Compare 935277682551 with alternatives